Ideal for industrial applications
Spectrum PC/PTFE Filament is an advanced polycarbonate (PC) based composite filament with the addition of PTFE, commonly known as Teflon.
Polycarbonate offers high mechanical resistance and PTFE complements other properties by reducing wear and friction.
The applied modifications ensure improved thermal stability of the printed models, improved electrical insulation and higher chemical and water resistance. Due to its properties, Spectrum PC/PTFE filament is a material for a wide range of industrial applications and is ideal for the manufacture of parts with complex geometries while maintaining a relatively high level of dimensional accuracy.
Main features
- Low processing shrinkage (linear) approx. 0.6%
- High Heat Resistance (HDT) – 140°C
- Vicat Softening Point – 145°C
- Flammability class UL 94 (3.0 mm) – V1
- Electrical resistance 1E12 ohms
- Static coefficient of friction – 0.18
- Dynamic friction coefficient – 0.14
- High abrasion resistance
- High mechanical strength
- Best layer adhesion
Applications
- Production of low-friction parts
- Production of parts for thermal, electrical and thermal insulation
- Manufacture of low-load gears and transmission elements
- Manufacturing tools used to assemble components during the production process
- Parts for end use
- Functional prototyping
Printing & Storage of Spectrum PC/PTFE Filament
In order to achieve the attractive properties of Spectrum PC/PTFE from a technical point of view, care must be taken to store the material properly. Storage in a dry and dark place with a humidity of less than 15% is ideal.
In order to get the best possible parameters of the model, it is recommended to dry the material before use.
Tip: It is also recommended to print with a heated chamber.
Packaging
The filament is wound on a clean, transparent spool. Each spool contains information about the type of material, the diameter and the recommended printing temperature. The filament is vacuum packed with a moisture absorber. A user manual is included in the packaging.














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